Lamination Bond Strength

Projectname:
Lamination Bond Strength of Packaging Films for Aggressive Products

Workgroup: Filling and packaging processes

Scientific Partners and Guidance:
Fraunhofer Institute for Process Engineering and Packaging IVV, Dr. K. Müller

Financing: IVLV
Duration: 2010

Introduction:

Packaging material for aggressive products must have very good lamination bond strengths. Problems occur in case of inorganic barrier layers, like aluminium laminates or vacuum coated layers. For example fatty or acid food ingredients diffuse through the sealing layer to the inorganic barrier layer. In some cases these ingredients accumulate at the interface and weaken the lamination bond strength. Sensitive interlayer, which tend to delamination are adhesives layers. Therefore delamination could appear even between layers without direct food contact.

Objective:

Following influencing factors of lamination bond strength are focused in this project:

  • Temperature / Arrhenius
  • Influence of food simulants or food ingredients on the delamination behaviour

Approach:

The lamination bond strength is influenced by mechanical or thermal stress and the permeation behaviour of the layers between packaged food and inorganic barrier layer. The external factors affecting the permeability and thus the delamination behaviour will be investigated: Time, temperature, humidity, mechanical stress

  • In the next step the property profiles of the adhesive pre-treatment and sealing layer should be varied regarding the lamination bond strength
  • Use of barrier layers in the sealing material: The diffusion of critical ingredients through the sealing layer will be reduced by co extrusion of barrier layers (e.g. EVOH) and polyethylene

Final Report